SEAF-50-06.0-S-08-2-A-K-TR Samtec Inc.
Hersteller: Samtec Inc.Description: CONN HD ARRAY RCPT 400P SMD GOLD
Packaging: Cut Tape (CT)
Features: Board Guide, Pick and Place
Connector Type: High Density Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 400
Pitch: 0.050" (1.27mm)
Height Above Board: 0.238" (6.05mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 8mm, 9mm, 9.5mm, 12.5mm, 13mm, 15mm, 17mm, 19mm
Part Status: Active
Number of Rows: 8
auf Bestellung 98 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 56.8 EUR |
| 10+ | 49.73 EUR |
| 25+ | 47.58 EUR |
| 50+ | 46.05 EUR |
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Technische Details SEAF-50-06.0-S-08-2-A-K-TR Samtec Inc.
Description: CONN HD ARRAY RCPT 400P SMD GOLD, Features: Board Guide, Pick and Place, Packaging: Tape & Reel (TR), Connector Type: High Density Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 400, Pitch: 0.050" (1.27mm), Height Above Board: 0.238" (6.05mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 8mm, 9mm, 9.5mm, 12.5mm, 13mm, 15mm, 17mm, 19mm, Part Status: Active, Number of Rows: 8.
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SEAF-50-06.0-S-08-2-A-K-TR | Hersteller : Samtec Inc. |
Description: CONN HD ARRAY RCPT 400P SMD GOLD Features: Board Guide, Pick and Place Packaging: Tape & Reel (TR) Connector Type: High Density Array, Female Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 400 Pitch: 0.050" (1.27mm) Height Above Board: 0.238" (6.05mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 8mm, 9mm, 9.5mm, 12.5mm, 13mm, 15mm, 17mm, 19mm Part Status: Active Number of Rows: 8 |
Produkt ist nicht verfügbar |