SEAF8-30-05.0-S-06-3 Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN HD ARRAY RCPT 0.8MM 6X30POS
Packaging: Tape & Reel (TR)
Features: Board Guide
Connector Type: High Density Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 180
Pitch: 0.031" (0.80mm)
Height Above Board: 0.180" (4.57mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 10mm
Part Status: Active
Number of Rows: 6
Produktrezensionen
Produktbewertung abgeben
Technische Details SEAF8-30-05.0-S-06-3 Samtec Inc.
Description: CONN HD ARRAY RCPT 0.8MM 6X30POS, Packaging: Tape & Reel (TR), Features: Board Guide, Connector Type: High Density Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 180, Pitch: 0.031" (0.80mm), Height Above Board: 0.180" (4.57mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 7mm, 10mm, Part Status: Active, Number of Rows: 6.
Weitere Produktangebote SEAF8-30-05.0-S-06-3 nach Preis ab 22.65 EUR bis 33.72 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
SEAF8-30-05.0-S-06-3 | Samtec Inc. |
Description: CONN HD ARRAY RCPT 0.8MM 6X30POS Packaging: Cut Tape (CT) Features: Board Guide Connector Type: High Density Array, Female Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 180 Pitch: 0.031" (0.80mm) Height Above Board: 0.180" (4.57mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 7mm, 10mm Part Status: Active Number of Rows: 6 |
auf Bestellung 1370 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
SEAF8-30-05.0-S-06-3 | Samtec |
Board to Board & Mezzanine Connectors 0.80 mm SEARAY(TM) High-Speed High-Density Open-Pin-Field Array Socket |
auf Bestellung 419 Stücke: Lieferzeit 10-14 Tag (e) |
|
| SEAF8-30-05.0-S-06-3 |
|
Hersteller: Samtec Inc.
Description: CONN HD ARRAY RCPT 0.8MM 6X30POS
Packaging: Cut Tape (CT)
Features: Board Guide
Connector Type: High Density Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 180
Pitch: 0.031" (0.80mm)
Height Above Board: 0.180" (4.57mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 10mm
Part Status: Active
Number of Rows: 6
Description: CONN HD ARRAY RCPT 0.8MM 6X30POS
Packaging: Cut Tape (CT)
Features: Board Guide
Connector Type: High Density Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 180
Pitch: 0.031" (0.80mm)
Height Above Board: 0.180" (4.57mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 10mm
Part Status: Active
Number of Rows: 6
auf Bestellung 1370 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 31.64 EUR |
| 10+ | 26.89 EUR |
| 25+ | 25.21 EUR |
| 50+ | 24 EUR |
| 100+ | 23.85 EUR |
| SEAF8-30-05.0-S-06-3 |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors 0.80 mm SEARAY(TM) High-Speed High-Density Open-Pin-Field Array Socket
Board to Board & Mezzanine Connectors 0.80 mm SEARAY(TM) High-Speed High-Density Open-Pin-Field Array Socket
auf Bestellung 419 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 33.72 EUR |
| 10+ | 31.94 EUR |
| 25+ | 30.73 EUR |
| 50+ | 29.97 EUR |
| 100+ | 24.46 EUR |
| 250+ | 22.65 EUR |