SEAFP-40-01-S-10-RA-WT Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN HD ARRAY F 400POS P-FIT R/A
Number of Rows: 10
Contact Finish Thickness: 30.0µin (0.76µm)
Pitch: 0.050" (1.27mm)
Number of Positions: 400
Mounting Type: Through Hole, Right Angle, Press-Fit
Contact Finish: Gold
Connector Type: High Density Array, Female
Features: Solder Retention
Packaging: Tray
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Technische Details SEAFP-40-01-S-10-RA-WT Samtec Inc.
Description: CONN HD ARRAY F 400POS P-FIT R/A, Number of Rows: 10, Contact Finish Thickness: 30.0µin (0.76µm), Pitch: 0.050" (1.27mm), Number of Positions: 400, Mounting Type: Through Hole, Right Angle, Press-Fit, Contact Finish: Gold, Connector Type: High Density Array, Female, Features: Solder Retention, Packaging: Tray.

