Produkte > SAMTEC INC. > SEAFP-50-01-L-08-RA-WT

SEAFP-50-01-L-08-RA-WT Samtec Inc.

SEAFP-50-01-L-08-RA-WT Hersteller: Samtec Inc.
Description: .050" SEARAY HIGH-SPEED OPEN-PIN
Packaging: Tray
Features: Solder Retention
Connector Type: High Density Array, Female
Contact Finish: Gold
Mounting Type: Through Hole, Right Angle, Press-Fit
Number of Positions: 400
Pitch: 0.050" (1.27mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Number of Rows: 8
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Technische Details SEAFP-50-01-L-08-RA-WT Samtec Inc.

Description: .050" SEARAY HIGH-SPEED OPEN-PIN, Packaging: Tray, Features: Solder Retention, Connector Type: High Density Array, Female, Contact Finish: Gold, Mounting Type: Through Hole, Right Angle, Press-Fit, Number of Positions: 400, Pitch: 0.050" (1.27mm), Contact Finish Thickness: 10.0µin (0.25µm), Number of Rows: 8.