Produkte > SAMTEC INC. > SEAMP-20-02.0-L-04
SEAMP-20-02.0-L-04

SEAMP-20-02.0-L-04 Samtec Inc.

seamp.pdf
Hersteller: Samtec Inc.
Description: CONN HD ARRAY M 80POS PRESS-FIT
Number of Rows: 4
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Contact Finish Thickness: 10.0µin (0.25µm)
Height Above Board: 0.181" (4.60mm)
Pitch: 0.050" (1.27mm)
Number of Positions: 80
Mounting Type: Through Hole
Contact Finish: Gold
Connector Type: High Density Array, Male
Packaging: Tray
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Technische Details SEAMP-20-02.0-L-04 Samtec Inc.

Description: CONN HD ARRAY M 80POS PRESS-FIT, Number of Rows: 4, Mated Stacking Heights: 7mm, 8mm, 8.5mm, Contact Finish Thickness: 10.0µin (0.25µm), Height Above Board: 0.181" (4.60mm), Pitch: 0.050" (1.27mm), Number of Positions: 80, Mounting Type: Through Hole, Contact Finish: Gold, Connector Type: High Density Array, Male, Packaging: Tray.