Technische Details SEAMP-20-02.0-S-06 Samtec
Description: CONN HD ARRAY M 120POS PRESS-FIT, Packaging: Tray, Connector Type: High Density Array, Male, Contact Finish: Gold, Mounting Type: Through Hole, Number of Positions: 120, Pitch: 0.050" (1.27mm), Height Above Board: 0.181" (4.60mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 7mm, 8mm, 8.5mm, Number of Rows: 6.
Weitere Produktangebote SEAMP-20-02.0-S-06
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SEAMP-20-02.0-S-06 | Hersteller : Samtec Inc. |
 Description: CONN HD ARRAY M 120POS PRESS-FITPackaging: Tray Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 120 Pitch: 0.050" (1.27mm) Height Above Board: 0.181" (4.60mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 7mm, 8mm, 8.5mm Number of Rows: 6 |
Produkt ist nicht verfügbar |
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SEAMP-20-02.0-S-06 | Hersteller : Samtec |
Board to Board & Mezzanine Connectors .050" SEARAY High-Speed High-Density Open-Pin-Field Array Terminal, Press-Fit |
Produkt ist nicht verfügbar |