SEAMP-30-02.0-L-04 Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN HD ARRAY M 120POS PRESS-FIT
Number of Rows: 4
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Contact Finish Thickness: 10.0µin (0.25µm)
Height Above Board: 0.181" (4.60mm)
Pitch: 0.050" (1.27mm)
Number of Positions: 120
Mounting Type: Through Hole
Contact Finish: Gold
Connector Type: High Density Array, Male
Packaging: Tray
| Anzahl | Preis |
|---|---|
| 1+ | 32.61 EUR |
| 10+ | 28.26 EUR |
| 25+ | 26.79 EUR |
| 52+ | 26.4 EUR |
| 104+ | 23.29 EUR |
| 260+ | 21.74 EUR |
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Technische Details SEAMP-30-02.0-L-04 Samtec Inc.
Description: CONN HD ARRAY M 120POS PRESS-FIT, Number of Rows: 4, Mated Stacking Heights: 7mm, 8mm, 8.5mm, Contact Finish Thickness: 10.0µin (0.25µm), Height Above Board: 0.181" (4.60mm), Pitch: 0.050" (1.27mm), Number of Positions: 120, Mounting Type: Through Hole, Contact Finish: Gold, Connector Type: High Density Array, Male, Packaging: Tray.
Weitere Produktangebote SEAMP-30-02.0-L-04
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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SEAMP-30-02.0-L-04 | Samtec |
Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| SEAMP-30-02.0-L-04 |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH