SEEPROM3-KIT Microchip Technology
Hersteller: Microchip Technology
Description: KIT HIGH-DENSITY SERIAL EEPROM
Packaging: Case
Mounting Type: Through Hole
Quantity: 9 Pieces (3 Values - 3 Each)
Kit Type: Memory
Description: KIT HIGH-DENSITY SERIAL EEPROM
Packaging: Case
Mounting Type: Through Hole
Quantity: 9 Pieces (3 Values - 3 Each)
Kit Type: Memory
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Technische Details SEEPROM3-KIT Microchip Technology
Description: KIT HIGH-DENSITY SERIAL EEPROM, Packaging: Case, Mounting Type: Through Hole, Quantity: 9 Pieces (3 Values - 3 Each), Kit Type: Memory.