SEM-115-02-03.0-H-D-WT Samtec
auf Bestellung 64 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 9.8 EUR |
| 510+ | 9.38 EUR |
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Technische Details SEM-115-02-03.0-H-D-WT Samtec
Description: CONN RCPT 30POS 0.031 GOLD SMD, Packaging: Tray, Features: Solder Retention, Connector Type: Receptacle, Current Rating (Amps): 2.6A per Contact, Mounting Type: Surface Mount, Number of Positions: 30, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Mated Stacking Heights: 6mm, 7mm, 10mm, Insulation Color: Black, Pitch - Mating: 0.031" (0.80mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Gold, Part Status: Active, Insulation Height: 0.177" (4.50mm), Row Spacing - Mating: 0.125" (3.18mm), Number of Rows: 2.
Weitere Produktangebote SEM-115-02-03.0-H-D-WT nach Preis ab 10.23 EUR bis 10.23 EUR
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SEM-115-02-03.0-H-D-WT | Hersteller : Samtec Inc. |
 Description: CONN RCPT 30POS 0.031 GOLD SMDPackaging: Tray Features: Solder Retention Connector Type: Receptacle Current Rating (Amps): 2.6A per Contact Mounting Type: Surface Mount Number of Positions: 30 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Mated Stacking Heights: 6mm, 7mm, 10mm Insulation Color: Black Pitch - Mating: 0.031" (0.80mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Gold Part Status: Active Insulation Height: 0.177" (4.50mm) Row Spacing - Mating: 0.125" (3.18mm) Number of Rows: 2 |
auf Bestellung 170 Stücke: Lieferzeit 10-14 Tag (e) |
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