SF-1206SP175L-2-A9 Bourns
Hersteller: BournsFuse Chip Slow Blow Acting 1.75A 63V SMD Solder Pad 1206 3.1 X 1.6 X 0.9mm Ceramic T/R
auf Bestellung 16000 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 16000+ | 0.18 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details SF-1206SP175L-2-A9 Bourns
Description: FUSE BOARD MNT 1.75A 63VDC 1206, Packaging: Tape & Reel (TR), Package / Case: 1206 (3216 Metric), Size / Dimension: 0.122" L x 0.063" W x 0.035" H (3.10mm x 1.60mm x 0.90mm), Fuse Type: Board Mount (Cartridge Style Excluded), Mounting Type: Surface Mount, Operating Temperature: -55°C ~ 125°C, Response Time: Slow Blow, Approval Agency: cUL, UL, Breaking Capacity @ Rated Voltage: 100A, Part Status: Active, Current Rating (Amps): 1.75 A, Voltage Rating - DC: 63 V, Melting I²t: 1.5.
Weitere Produktangebote SF-1206SP175L-2-A9 nach Preis ab 0.18 EUR bis 0.56 EUR
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SF-1206SP175L-2-A9 | Hersteller : Bourns |
Fuse Chip Slow Blow Acting 1.75A 63V SMD Solder Pad 1206 3.1 X 1.6 X 0.9mm Ceramic T/R |
auf Bestellung 16000 Stücke: Lieferzeit 14-21 Tag (e) |
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SF-1206SP175L-2-A9 | Hersteller : Bourns |
Fuse Chip Slow Blow Acting 1.75A 63V SMD Solder Pad 1206 3.1 X 1.6 X 0.9mm Ceramic T/R |
auf Bestellung 22500 Stücke: Lieferzeit 14-21 Tag (e) |
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SF-1206SP175L-2-A9 | Hersteller : Bourns |
Surface Mount Fuses 1.75A 63V TIME DELAY |
auf Bestellung 1112 Stücke: Lieferzeit 10-14 Tag (e) |
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SF-1206SP175L-2-A9 | Hersteller : Bourns Inc. |
Description: FUSE BOARD MNT 1.75A 63VDC 1206 Packaging: Cut Tape (CT) Package / Case: 1206 (3216 Metric) Size / Dimension: 0.122" L x 0.063" W x 0.035" H (3.10mm x 1.60mm x 0.90mm) Fuse Type: Board Mount (Cartridge Style Excluded) Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C Response Time: Slow Blow Approval Agency: cUL, UL Breaking Capacity @ Rated Voltage: 100A Part Status: Active Current Rating (Amps): 1.75 A Voltage Rating - DC: 63 V Melting I²t: 1.5 |
auf Bestellung 610 Stücke: Lieferzeit 10-14 Tag (e) |
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SF-1206SP175L-2-A9 | Hersteller : Bourns |
Fuse Chip Slow Blow Acting 1.75A 63V SMD Solder Pad 1206 3.1 X 1.6 X 0.9mm Ceramic T/R |
auf Bestellung 16000 Stücke: Lieferzeit 14-21 Tag (e) |
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SF-1206SP175L-2-A9 | Hersteller : Bourns |
Fuse Chip Slow Blow Acting 1.75A 63V SMD Solder Pad 1206 3.1 X 1.6 X 0.9mm Ceramic T/R |
Produkt ist nicht verfügbar |
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SF-1206SP175L-2-A9 | Hersteller : Bourns Inc. |
Description: FUSE BOARD MNT 1.75A 63VDC 1206 Packaging: Tape & Reel (TR) Package / Case: 1206 (3216 Metric) Size / Dimension: 0.122" L x 0.063" W x 0.035" H (3.10mm x 1.60mm x 0.90mm) Fuse Type: Board Mount (Cartridge Style Excluded) Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C Response Time: Slow Blow Approval Agency: cUL, UL Breaking Capacity @ Rated Voltage: 100A Part Status: Active Current Rating (Amps): 1.75 A Voltage Rating - DC: 63 V Melting I²t: 1.5 |
Produkt ist nicht verfügbar |