SF-1206SP175L-2-A9 Bourns
Hersteller: Bourns
Fuse Chip Slow Blow Acting 1.75A 63V SMD Solder Pad 1206 3.1 X 1.6 X 0.9mm Ceramic T/R
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Technische Details SF-1206SP175L-2-A9 Bourns
Description: FUSE BOARD MNT 1.75A 63VDC 1206, Packaging: Tape & Reel (TR), Package / Case: 1206 (3216 Metric), Size / Dimension: 0.122" L x 0.063" W x 0.035" H (3.10mm x 1.60mm x 0.90mm), Fuse Type: Board Mount (Cartridge Style Excluded), Mounting Type: Surface Mount, Operating Temperature: -55°C ~ 125°C, Response Time: Slow Blow, Approval Agency: cUL, UL, Breaking Capacity @ Rated Voltage: 100A, Part Status: Active, Current Rating (Amps): 1.75 A, Voltage Rating - DC: 63 V, Melting I²t: 1.5.
Weitere Produktangebote SF-1206SP175L-2-A9 nach Preis ab 0.2 EUR bis 0.8 EUR
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SF-1206SP175L-2-A9 | Bourns |
Fuse Chip Slow Blow Acting 1.75A 63V SMD Solder Pad 1206 3.1 X 1.6 X 0.9mm Ceramic T/R |
auf Bestellung 16000 Stücke: Lieferzeit 14-21 Tag (e) |
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SF-1206SP175L-2-A9 | Bourns |
Fuse Chip Slow Blow Acting 1.75A 63V SMD Solder Pad 1206 3.1 X 1.6 X 0.9mm Ceramic T/R |
auf Bestellung 22500 Stücke: Lieferzeit 14-21 Tag (e) |
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SF-1206SP175L-2-A9 | Bourns Inc. |
Description: FUSE BOARD MNT 1.75A 63VDC 1206 Packaging: Cut Tape (CT) Package / Case: 1206 (3216 Metric) Size / Dimension: 0.122" L x 0.063" W x 0.035" H (3.10mm x 1.60mm x 0.90mm) Fuse Type: Board Mount (Cartridge Style Excluded) Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C Response Time: Slow Blow Approval Agency: cUL, UL Breaking Capacity @ Rated Voltage: 100A Part Status: Active Current Rating (Amps): 1.75 A Voltage Rating - DC: 63 V Melting I²t: 1.5 |
auf Bestellung 50 Stücke: Lieferzeit 10-14 Tag (e) |
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| SF-1206SP175L-2-A9 |
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Hersteller: Bourns
Fuse Chip Slow Blow Acting 1.75A 63V SMD Solder Pad 1206 3.1 X 1.6 X 0.9mm Ceramic T/R
Fuse Chip Slow Blow Acting 1.75A 63V SMD Solder Pad 1206 3.1 X 1.6 X 0.9mm Ceramic T/R
auf Bestellung 16000 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 16000+ | 0.2 EUR |
| SF-1206SP175L-2-A9 |
|
Hersteller: Bourns
Fuse Chip Slow Blow Acting 1.75A 63V SMD Solder Pad 1206 3.1 X 1.6 X 0.9mm Ceramic T/R
Fuse Chip Slow Blow Acting 1.75A 63V SMD Solder Pad 1206 3.1 X 1.6 X 0.9mm Ceramic T/R
auf Bestellung 22500 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2500+ | 0.32 EUR |
| 5000+ | 0.3 EUR |
| 7500+ | 0.29 EUR |
| 17500+ | 0.26 EUR |
| SF-1206SP175L-2-A9 |
|
Hersteller: Bourns Inc.
Description: FUSE BOARD MNT 1.75A 63VDC 1206
Packaging: Cut Tape (CT)
Package / Case: 1206 (3216 Metric)
Size / Dimension: 0.122" L x 0.063" W x 0.035" H (3.10mm x 1.60mm x 0.90mm)
Fuse Type: Board Mount (Cartridge Style Excluded)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Response Time: Slow Blow
Approval Agency: cUL, UL
Breaking Capacity @ Rated Voltage: 100A
Part Status: Active
Current Rating (Amps): 1.75 A
Voltage Rating - DC: 63 V
Melting I²t: 1.5
Description: FUSE BOARD MNT 1.75A 63VDC 1206
Packaging: Cut Tape (CT)
Package / Case: 1206 (3216 Metric)
Size / Dimension: 0.122" L x 0.063" W x 0.035" H (3.10mm x 1.60mm x 0.90mm)
Fuse Type: Board Mount (Cartridge Style Excluded)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Response Time: Slow Blow
Approval Agency: cUL, UL
Breaking Capacity @ Rated Voltage: 100A
Part Status: Active
Current Rating (Amps): 1.75 A
Voltage Rating - DC: 63 V
Melting I²t: 1.5
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 27+ | 0.8 EUR |
| 32+ | 0.65 EUR |
| 35+ | 0.61 EUR |
| 50+ | 0.5 EUR |