SI4023-S ALUTRONIC
Hersteller: ALUTRONIC
Category: Heatsinks - equipment
Description: Heat transfer pad: silicone; Thk: 0.23mm; 900mW/mK; -60÷200°C; 5kV
Type of heat transfer pad: silicone
Material: glass fiber reinforced silicone
Thickness: 0.23mm
Thermal conductivity: 0.9W/mK
Operating temperature: -60...200°C
Dielectric strength: 5kV
Dimensions: 200x200mm
Category: Heatsinks - equipment
Description: Heat transfer pad: silicone; Thk: 0.23mm; 900mW/mK; -60÷200°C; 5kV
Type of heat transfer pad: silicone
Material: glass fiber reinforced silicone
Thickness: 0.23mm
Thermal conductivity: 0.9W/mK
Operating temperature: -60...200°C
Dielectric strength: 5kV
Dimensions: 200x200mm
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Technische Details SI4023-S ALUTRONIC
Category: Heatsinks - equipment, Description: Heat transfer pad: silicone; Thk: 0.23mm; 900mW/mK; -60÷200°C; 5kV, Type of heat transfer pad: silicone, Material: glass fiber reinforced silicone, Thickness: 0.23mm, Thermal conductivity: 0.9W/mK, Operating temperature: -60...200°C, Dielectric strength: 5kV, Dimensions: 200x200mm.