SI485 ALUTRONIC
Hersteller: ALUTRONIC
Category: Heatsinks - equipment
Description: Heat transfer pad: silicone; SOT32; Thk: 0.18mm; 900mW/mK; 4kV
Type of heat transfer pad: silicone
Application: SOT32
Thickness: 0.18mm
Thermal conductivity: 0.9W/mK
Operating temperature: -60...200°C
Dielectric strength: 4kV
Mounting: screw
Material: glass fiber reinforced silicone
Dimensions: 7.9x11.1mm
Anzahl je Verpackung: 1 Stücke
Category: Heatsinks - equipment
Description: Heat transfer pad: silicone; SOT32; Thk: 0.18mm; 900mW/mK; 4kV
Type of heat transfer pad: silicone
Application: SOT32
Thickness: 0.18mm
Thermal conductivity: 0.9W/mK
Operating temperature: -60...200°C
Dielectric strength: 4kV
Mounting: screw
Material: glass fiber reinforced silicone
Dimensions: 7.9x11.1mm
Anzahl je Verpackung: 1 Stücke
auf Bestellung 100 Stücke:
Lieferzeit 7-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 22+ | 3.32 EUR |
| 23+ | 3.15 EUR |
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Technische Details SI485 ALUTRONIC
Category: Heatsinks - equipment, Description: Heat transfer pad: silicone; SOT32; Thk: 0.18mm; 900mW/mK; 4kV, Type of heat transfer pad: silicone, Application: SOT32, Thickness: 0.18mm, Thermal conductivity: 0.9W/mK, Operating temperature: -60...200°C, Dielectric strength: 4kV, Mounting: screw, Material: glass fiber reinforced silicone, Dimensions: 7.9x11.1mm, Anzahl je Verpackung: 1 Stücke.
Weitere Produktangebote SI485 nach Preis ab 3.15 EUR bis 3.32 EUR
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SI485 | Hersteller : ALUTRONIC |
Category: Heatsinks - equipment Description: Heat transfer pad: silicone; SOT32; Thk: 0.18mm; 900mW/mK; 4kV Type of heat transfer pad: silicone Application: SOT32 Thickness: 0.18mm Thermal conductivity: 0.9W/mK Operating temperature: -60...200°C Dielectric strength: 4kV Mounting: screw Material: glass fiber reinforced silicone Dimensions: 7.9x11.1mm |
auf Bestellung 100 Stücke: Lieferzeit 14-21 Tag (e) |
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