Produkte > AMPHENOL ICC (FCI) > SIP050-1X31-157BLF

SIP050-1X31-157BLF Amphenol ICC (FCI)


58805.pdf Hersteller: Amphenol ICC (FCI)
Description: CONN SOCKET SIP 31POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 31 (1 x 31)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Obsolete
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Technische Details SIP050-1X31-157BLF Amphenol ICC (FCI)

Description: CONN SOCKET SIP 31POS TIN, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: SIP, Number of Positions or Pins (Grid): 31 (1 x 31), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass, Part Status: Obsolete.