SLM-118-01-S-S Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN RCPT 18POS 0.05 GOLD PCB
Number of Rows: 1
Insulation Height: 0.180" (4.57mm)
Contact Length - Post: 0.115" (2.92mm)
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Forked
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 18
Mounting Type: Through Hole
Connector Type: Receptacle
Packaging: Tube
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Black
| Anzahl | Privatkunde |
|---|---|
| 3+ | 8.46 EUR |
| 50+ | 6.9 EUR |
| 100+ | 5.85 EUR |
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Technische Details SLM-118-01-S-S Samtec Inc.
Description: CONN RCPT 18POS 0.05 GOLD PCB, Number of Rows: 1, Insulation Height: 0.180" (4.57mm), Contact Length - Post: 0.115" (2.92mm), Part Status: Active, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Forked, Operating Temperature: -55°C ~ 125°C, Style: Board to Board, Number of Positions: 18, Mounting Type: Through Hole, Connector Type: Receptacle, Packaging: Tube, Pitch - Mating: 0.050" (1.27mm), Insulation Color: Black.
Weitere Produktangebote SLM-118-01-S-S
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
 |
SLM-118-01-S-S | Samtec |
Headers & Wire Housings Through-Hole Micro Socket |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| SLM-118-01-S-S |
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Hersteller: Samtec
Headers & Wire Housings Through-Hole Micro Socket
Headers & Wire Housings Through-Hole Micro Socket
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH