SLW-113-01-S-D Samtec
| Anzahl | Privatkunde |
|---|---|
| 1+ | 9.48 EUR |
| 25+ | 8.79 EUR |
| 50+ | 8.38 EUR |
| 100+ | 7.52 EUR |
| 500+ | 7.28 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details SLW-113-01-S-D Samtec
Description: CONN RCPT 26POS 0.1 GOLD PCB, Number of Rows: 2, Row Spacing - Mating: 0.100" (2.54mm), Insulation Height: 0.180" (4.57mm), Contact Length - Post: 0.115" (2.92mm), Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Insulation Color: Black, Mated Stacking Heights: 6.09mm, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Forked, Operating Temperature: -55°C ~ 125°C, Style: Board to Board, Number of Positions: 26, Mounting Type: Through Hole, Connector Type: Receptacle, Packaging: Bulk.
Weitere Produktangebote SLW-113-01-S-D nach Preis ab 7.21 EUR bis 10.61 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
SLW-113-01-S-D | Samtec Inc. |
 Description: CONN RCPT 26POS 0.1 GOLD PCBNumber of Rows: 2 Row Spacing - Mating: 0.100" (2.54mm) Insulation Height: 0.180" (4.57mm) Contact Length - Post: 0.115" (2.92mm) Contact Finish - Post: Tin Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Insulation Color: Black Mated Stacking Heights: 6.09mm Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Forked Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 26 Mounting Type: Through Hole Connector Type: Receptacle Packaging: Bulk |
auf Bestellung 808 Stücke: Lieferzeit 10-14 Tag (e) |
|
| SLW-113-01-S-D |
|
Hersteller: Samtec Inc.
Description: CONN RCPT 26POS 0.1 GOLD PCB
Number of Rows: 2
Row Spacing - Mating: 0.100" (2.54mm)
Insulation Height: 0.180" (4.57mm)
Contact Length - Post: 0.115" (2.92mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Mated Stacking Heights: 6.09mm
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Forked
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 26
Mounting Type: Through Hole
Connector Type: Receptacle
Packaging: Bulk
Description: CONN RCPT 26POS 0.1 GOLD PCB
Number of Rows: 2
Row Spacing - Mating: 0.100" (2.54mm)
Insulation Height: 0.180" (4.57mm)
Contact Length - Post: 0.115" (2.92mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Mated Stacking Heights: 6.09mm
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Forked
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 26
Mounting Type: Through Hole
Connector Type: Receptacle
Packaging: Bulk
auf Bestellung 808 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 10.61 EUR |
| 10+ | 9.64 EUR |
| 100+ | 8.48 EUR |
| 500+ | 7.21 EUR |