SLW-113-01-S-D Samtec
| Anzahl | Privatkunde |
|---|---|
| 1+ | 8.45 EUR |
| 25+ | 7.83 EUR |
| 50+ | 7.46 EUR |
| 100+ | 6.69 EUR |
| 500+ | 6.49 EUR |
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10-14 Tag (e)
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Technische Details SLW-113-01-S-D Samtec
Description: CONN RCPT 26POS 0.1 GOLD PCB, Packaging: Bulk, Connector Type: Receptacle, Mounting Type: Through Hole, Number of Positions: 26, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Mated Stacking Heights: 6.09mm, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Tin, Contact Length - Post: 0.115" (2.92mm), Insulation Height: 0.180" (4.57mm), Row Spacing - Mating: 0.100" (2.54mm), Number of Rows: 2.
Weitere Produktangebote SLW-113-01-S-D nach Preis ab 7.21 EUR bis 10.61 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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SLW-113-01-S-D | Samtec Inc. |
 Description: CONN RCPT 26POS 0.1 GOLD PCBPackaging: Bulk Connector Type: Receptacle Mounting Type: Through Hole Number of Positions: 26 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Mated Stacking Heights: 6.09mm Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Contact Length - Post: 0.115" (2.92mm) Insulation Height: 0.180" (4.57mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
auf Bestellung 808 Stücke: Lieferzeit 10-14 Tag (e) |
|
| SLW-113-01-S-D |
|
Hersteller: Samtec Inc.
Description: CONN RCPT 26POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Mounting Type: Through Hole
Number of Positions: 26
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Mated Stacking Heights: 6.09mm
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Length - Post: 0.115" (2.92mm)
Insulation Height: 0.180" (4.57mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
Description: CONN RCPT 26POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Mounting Type: Through Hole
Number of Positions: 26
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Mated Stacking Heights: 6.09mm
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Length - Post: 0.115" (2.92mm)
Insulation Height: 0.180" (4.57mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
auf Bestellung 808 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 10.61 EUR |
| 10+ | 9.64 EUR |
| 100+ | 8.48 EUR |
| 500+ | 7.21 EUR |