SMD2016-25000 Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Process: Lead Free
Form: Jar
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Solder Sphere
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.008" (0.20mm)
Packaging: Bulk
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Part Status: Active
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Technische Details SMD2016-25000 Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0., Process: Lead Free, Form: Jar, Melting Point: 423 ~ 428°F (217 ~ 220°C), Type: Solder Sphere, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.008" (0.20mm), Packaging: Bulk, Shelf Life: 24 Months, Shelf Life Start: Date of Manufacture, Part Status: Active.