SMD291SNL50T6 Chip Quik Inc.
Hersteller: Chip Quik Inc.Description: SOLDER PASTE IN JAR 50G (T6) SAC
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 6
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
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Technische Details SMD291SNL50T6 Chip Quik Inc.
Description: SOLDER PASTE IN JAR 50G (T6) SAC, Packaging: Bulk, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Type: Solder Paste, Melting Point: 422 ~ 428°F (217 ~ 220°C), Form: Jar, 1.76 oz (50g), Mesh Type: 6, Process: Lead Free, Flux Type: No-Clean, Part Status: Active, Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C), Shelf Life Start: Date of Manufacture, Shelf Life: 6 Months.