SMD2SW.031 4OZ Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 31 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 26.21 EUR |
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Technische Details SMD2SW.031 4OZ Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL, Packaging: Bulk, Diameter: 0.031" (0.79mm), Composition: Sn60Pb40 (60/40), Type: Wire Solder, Melting Point: 361 ~ 370°F (183 ~ 188°C), Form: Spool, 4 oz (113.40g), Process: Leaded, Flux Type: No-Clean, Water Soluble, Part Status: Active.