SMD2SWLF.031 4OZ Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Melting Point: 441°F (227°C)
Type: Wire Solder
Composition: Sn99.3Cu0.7 (99.3/0.7)
Diameter: 0.031" (0.79mm)
Packaging: Bulk
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Spool, 4 oz (113.40g)
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Technische Details SMD2SWLF.031 4OZ Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP, Melting Point: 441°F (227°C), Type: Wire Solder, Composition: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.031" (0.79mm), Packaging: Bulk, Part Status: Active, Flux Type: No-Clean, Water Soluble, Process: Lead Free, Form: Spool, 4 oz (113.40g).