SMD2SWLF.031 4OZ Chip Quik Inc.
Hersteller: Chip Quik Inc.Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 45.27 EUR |
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Technische Details SMD2SWLF.031 4OZ Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP, Packaging: Bulk, Diameter: 0.031" (0.79mm), Composition: Sn99.3Cu0.7 (99.3/0.7), Type: Wire Solder, Melting Point: 441°F (227°C), Form: Spool, 4 oz (113.40g), Process: Lead Free, Flux Type: No-Clean, Water Soluble, Part Status: Active.