SMDLTLFP500T3C Chip Quik Inc.

Description: SOLDER PASTE LOW TEMP T3 500G
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
1+ | 200.78 EUR |
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Technische Details SMDLTLFP500T3C Chip Quik Inc.
Description: SOLDER PASTE LOW TEMP T3 500G, Packaging: Bulk, Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Type: Solder Paste, Melting Point: 281°F (138°C), Form: Cartridge, 17.64 oz (500g), Mesh Type: 3, Process: Lead Free, Flux Type: No-Clean, Part Status: Active, Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C), Shelf Life Start: Date of Manufacture, Shelf Life: 6 Months.