SMDSW.031 1OZ Chip Quik Inc.
Hersteller: Chip Quik Inc.Description: SOLDER WIRE NO-CLEAN 63/37 1OZ.
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 12.21 EUR |
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Technische Details SMDSW.031 1OZ Chip Quik Inc.
Description: SOLDER WIRE NO-CLEAN 63/37 1OZ., Packaging: Spool, Diameter: 0.031" (0.79mm), Wire Gauge: 20 AWG, 22 SWG, Composition: Sn63Pb37 (63/37), Type: Wire Solder, Melting Point: 361°F (183°C), Form: Spool, 1 oz (28.35g), Process: Leaded, Flux Type: No-Clean, Water Soluble, Part Status: Active.