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Technische Details SMDSW.031 2oz Chip Quik
Description: SOLDER WIRE NO-CLEAN 63/37 2OZ., Packaging: Spool, Diameter: 0.031" (0.79mm), Wire Gauge: 20 AWG, 22 SWG, Composition: Sn63Pb37 (63/37), Type: Wire Solder, Melting Point: 361°F (183°C), Form: Spool, 2 oz (56.70g), Process: Leaded, Flux Type: No-Clean, Water Soluble, Part Status: Active.
Weitere Produktangebote SMDSW.031 2oz nach Preis ab 19.06 EUR bis 19.06 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
|---|---|---|---|---|---|---|---|
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SMDSW.031 2oz | Chip Quik Inc. |
 Description: SOLDER WIRE NO-CLEAN 63/37 2OZ.Packaging: Spool Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 2 oz (56.70g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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| SMDSW.031 2oz |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE NO-CLEAN 63/37 2OZ.
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE NO-CLEAN 63/37 2OZ.
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 19.06 EUR |