SMDSWLF.004 20G Chip Quik
Hersteller: Chip Quik
Solder LF Solder Wire Sn96.5/Ag3/Cu0.5 No-Clean Water-Washable .004 20g ULTRA THIN
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Technische Details SMDSWLF.004 20G Chip Quik
Description: LF SOLDER WIRE SN96.5/AG3/CU0.5, Form: Spool, 0.7 oz (20g), Melting Point: 423 ~ 428°F (217 ~ 220°C), Type: Wire Solder, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.004" (0.10mm), Packaging: Bulk, Shelf Life: 60 Months, Shelf Life Start: Date of Manufacture, Part Status: Active.
Weitere Produktangebote SMDSWLF.004 20G nach Preis ab 418.77 EUR bis 418.77 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
|---|---|---|---|---|---|---|---|
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SMDSWLF.004 20G | Chip Quik Inc. |
Description: LF SOLDER WIRE SN96.5/AG3/CU0.5 Form: Spool, 0.7 oz (20g) Melting Point: 423 ~ 428°F (217 ~ 220°C) Type: Wire Solder Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Diameter: 0.004" (0.10mm) Packaging: Bulk Shelf Life: 60 Months Shelf Life Start: Date of Manufacture Part Status: Active |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
|
| SMDSWLF.004 20G |
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE SN96.5/AG3/CU0.5
Form: Spool, 0.7 oz (20g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.004" (0.10mm)
Packaging: Bulk
Shelf Life: 60 Months
Shelf Life Start: Date of Manufacture
Part Status: Active
Description: LF SOLDER WIRE SN96.5/AG3/CU0.5
Form: Spool, 0.7 oz (20g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.004" (0.10mm)
Packaging: Bulk
Shelf Life: 60 Months
Shelf Life Start: Date of Manufacture
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 418.77 EUR |