SMDSWLF.006 1G Chip Quik
Hersteller: Chip Quik
Solder LF Solder Wire Sn96.5/Ag3/Cu0.5 No-Clean Water-Washable .006 1g ULTRA THIN
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Technische Details SMDSWLF.006 1G Chip Quik
Description: SOLDER WIRE SN96.5/AG3/CU0.5, Process: Lead Free, Form: Spool, 0.035 oz (1g), Melting Point: 423 ~ 428°F (217 ~ 220°C), Type: Wire Solder, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.006" (0.15mm), Packaging: Bulk, Part Status: Active, Flux Type: No-Clean, Water Soluble.
Weitere Produktangebote SMDSWLF.006 1G nach Preis ab 31.31 EUR bis 31.31 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
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SMDSWLF.006 1G | Chip Quik Inc. |
Description: SOLDER WIRE SN96.5/AG3/CU0.5 Process: Lead Free Form: Spool, 0.035 oz (1g) Melting Point: 423 ~ 428°F (217 ~ 220°C) Type: Wire Solder Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Diameter: 0.006" (0.15mm) Packaging: Bulk Part Status: Active Flux Type: No-Clean, Water Soluble |
auf Bestellung 19 Stücke: Lieferzeit 10-14 Tag (e) |
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| SMDSWLF.006 1G |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE SN96.5/AG3/CU0.5
Process: Lead Free
Form: Spool, 0.035 oz (1g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.006" (0.15mm)
Packaging: Bulk
Part Status: Active
Flux Type: No-Clean, Water Soluble
Description: SOLDER WIRE SN96.5/AG3/CU0.5
Process: Lead Free
Form: Spool, 0.035 oz (1g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.006" (0.15mm)
Packaging: Bulk
Part Status: Active
Flux Type: No-Clean, Water Soluble
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 31.31 EUR |