SMDSWLF.008 50G Chip Quik
Hersteller: Chip Quik
Solder LF Solder Wire 96.5/3/0.5 Tin/Silver/Copper no-clean .008 50g ULTRA THIN
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Technische Details SMDSWLF.008 50G Chip Quik
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI, Packaging: Bulk, Diameter: 0.008" (0.20mm), Wire Gauge: 32 AWG, 35 SWG, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Type: Wire Solder, Melting Point: 423 ~ 428°F (217 ~ 220°C), Form: Spool, 1.76 oz (50g), Process: Lead Free, Flux Type: No-Clean, Water Soluble, Part Status: Active.
Weitere Produktangebote SMDSWLF.008 50G nach Preis ab 132.55 EUR bis 132.55 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
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SMDSWLF.008 50G | Chip Quik Inc. |
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI Packaging: Bulk Diameter: 0.008" (0.20mm) Wire Gauge: 32 AWG, 35 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 1.76 oz (50g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 26 Stücke: Lieferzeit 10-14 Tag (e) |
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| SMDSWLF.008 50G |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.008" (0.20mm)
Wire Gauge: 32 AWG, 35 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1.76 oz (50g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.008" (0.20mm)
Wire Gauge: 32 AWG, 35 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1.76 oz (50g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 132.55 EUR |