SMDSWLF.015 .3OZ Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE POCKET PACK 96.5/
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Tube, 0.3 oz (8.51g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Wire Gauge: 27 AWG, 28 SWG
Diameter: 0.015" (0.38mm)
Packaging: Bulk
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Technische Details SMDSWLF.015 .3OZ Chip Quik Inc.
Description: LF SOLDER WIRE POCKET PACK 96.5/, Flux Type: No-Clean, Water Soluble, Process: Lead Free, Form: Tube, 0.3 oz (8.51g), Melting Point: 423 ~ 428°F (217 ~ 220°C), Type: Wire Solder, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Wire Gauge: 27 AWG, 28 SWG, Diameter: 0.015" (0.38mm), Packaging: Bulk.