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SMDSWLF.015 4OZ

SMDSWLF.015 4OZ Chip Quik Inc.


SMDSWLF.015 4OZ.pdf
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Spool, 4 oz (113.40g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.015" (0.38mm)
Packaging: Bulk
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Lieferzeit 10-14 Tag (e)
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Technische Details SMDSWLF.015 4OZ Chip Quik Inc.

Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI, Part Status: Active, Flux Type: No-Clean, Water Soluble, Process: Lead Free, Form: Spool, 4 oz (113.40g), Melting Point: 423 ~ 428°F (217 ~ 220°C), Type: Wire Solder, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.015" (0.38mm), Packaging: Bulk.