SMDSWLF.015 4OZ Chip Quik Inc.

Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
1+ | 53.68 EUR |
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Technische Details SMDSWLF.015 4OZ Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI, Packaging: Bulk, Diameter: 0.015" (0.38mm), Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Type: Wire Solder, Melting Point: 423 ~ 428°F (217 ~ 220°C), Form: Spool, 4 oz (113.40g), Process: Lead Free, Flux Type: No-Clean, Water Soluble, Part Status: Active.