SMDSWLF.020 .4OZ Chip Quik
Hersteller: Chip Quik
Solder LF Solder Wire Pocket Pack 96.5/3/0.5 Tin/Silver/Copper no-clean .020 .4oz
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Technische Details SMDSWLF.020 .4OZ Chip Quik
Description: LF SOLDER WIRE POCKET PACK 96.5/, Part Status: Active, Flux Type: No-Clean, Water Soluble, Process: Lead Free, Form: Tube, 0.4 oz (11.34g), Melting Point: 423 ~ 428°F (217 ~ 220°C), Type: Wire Solder, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Wire Gauge: 24 AWG, 25 SWG, Diameter: 0.020" (0.51mm), Packaging: Bulk.
Weitere Produktangebote SMDSWLF.020 .4OZ nach Preis ab 24.06 EUR bis 24.06 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
|---|---|---|---|---|---|---|---|
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SMDSWLF.020 .4OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE POCKET PACK 96.5/ Part Status: Active Flux Type: No-Clean, Water Soluble Process: Lead Free Form: Tube, 0.4 oz (11.34g) Melting Point: 423 ~ 428°F (217 ~ 220°C) Type: Wire Solder Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Wire Gauge: 24 AWG, 25 SWG Diameter: 0.020" (0.51mm) Packaging: Bulk |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| SMDSWLF.020 .4OZ |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE POCKET PACK 96.5/
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Tube, 0.4 oz (11.34g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Wire Gauge: 24 AWG, 25 SWG
Diameter: 0.020" (0.51mm)
Packaging: Bulk
Description: LF SOLDER WIRE POCKET PACK 96.5/
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Tube, 0.4 oz (11.34g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Wire Gauge: 24 AWG, 25 SWG
Diameter: 0.020" (0.51mm)
Packaging: Bulk
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 24.06 EUR |