SMDSWLF.059 3.3 1LB Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE SN96.5/AG3.0/CU0.5
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Spool, 1 lb (453.59g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.059" (1.50mm)
Packaging: Bulk
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Technische Details SMDSWLF.059 3.3 1LB Chip Quik Inc.
Description: SOLDER WIRE SN96.5/AG3.0/CU0.5, Part Status: Active, Flux Type: No-Clean, Water Soluble, Process: Lead Free, Form: Spool, 1 lb (453.59g), Melting Point: 423 ~ 428°F (217 ~ 220°C), Type: Wire Solder, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.059" (1.50mm), Packaging: Bulk.