Produkte > CYNEL > SN96,5AG3CU0,5-1.1.3 Q 1.00 500G
SN96,5AG3CU0,5-1.1.3 Q 1.00 500G

SN96,5AG3CU0,5-1.1.3 Q 1.00 500G CYNEL


pVersion=0046&contRep=ZT&docId=005056AB281E1EDFA89F4B5E0CF040D6&compId=SAC305_EN.pdf?ci_sign=9969f25e35d5507b121768ed9b19deaf797951a2 Hersteller: CYNEL
Category: Solder wires - lead free
Description: Tin; lead free; Sn96,5Ag3Cu0,5; 1mm; 500g; reel; 217÷219°C; 3%
Kind of flux: halide-free; No Clean; ROM0; rosin
Appearance: soldering wire
Kind of package: reel
Type of solder: tin
Melting point: 217...219°C
Alloy composition: Sn96,5Ag3Cu0,5
Flux content: 3%
Density: 7.37g/cm3
Flux name: SW32
Kind of solder: lead free
Flux residues: non-corrosive; transparent; yes
Binder weight: 0.5kg
Diameter: 1mm
Conform to the norm: EN ISO 9453; PN EN 29454 1.1.3
Version: for soft soldering
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5+87.84 EUR
10+80.38 EUR
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Technische Details SN96,5AG3CU0,5-1.1.3 Q 1.00 500G CYNEL

Category: Solder wires - lead free, Description: Tin; lead free; Sn96,5Ag3Cu0,5; 1mm; 500g; reel; 217÷219°C; 3%, Kind of flux: halide-free; No Clean; ROM0; rosin, Appearance: soldering wire, Kind of package: reel, Type of solder: tin, Melting point: 217...219°C, Alloy composition: Sn96,5Ag3Cu0,5, Flux content: 3%, Density: 7.37g/cm3, Flux name: SW32, Kind of solder: lead free, Flux residues: non-corrosive; transparent; yes, Binder weight: 0.5kg, Diameter: 1mm, Conform to the norm: EN ISO 9453; PN EN 29454 1.1.3, Version: for soft soldering.