SN99CU07AG03-1.1.3/0.5MM 250G CYNEL
Hersteller: CYNEL
Category: Solder wires - lead free
Description: Tin; lead free; Sn99Ag0,3Cu0,7; 500um; 250g; reel; 216÷227°C; 3%
Kind of flux: halide-free; No Clean; ROM0; rosin
Appearance: soldering wire
Kind of package: reel
Melting point: 216...227°C
Alloy composition: Sn99Ag0,3Cu0,7
Flux content: 3%
Density: 7.44g/cm3
Flux name: SW32
Kind of solder: lead free
Flux residues: non-corrosive; transparent; yes
Binder weight: 0.25kg
Diameter: 0.5mm
Conform to the norm: EN ISO 9453; PN EN 29454 1.1.3
Version: for soft soldering
Type of solder: tin
Category: Solder wires - lead free
Description: Tin; lead free; Sn99Ag0,3Cu0,7; 500um; 250g; reel; 216÷227°C; 3%
Kind of flux: halide-free; No Clean; ROM0; rosin
Appearance: soldering wire
Kind of package: reel
Melting point: 216...227°C
Alloy composition: Sn99Ag0,3Cu0,7
Flux content: 3%
Density: 7.44g/cm3
Flux name: SW32
Kind of solder: lead free
Flux residues: non-corrosive; transparent; yes
Binder weight: 0.25kg
Diameter: 0.5mm
Conform to the norm: EN ISO 9453; PN EN 29454 1.1.3
Version: for soft soldering
Type of solder: tin
auf Bestellung 31 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 3+ | 32.73 EUR |
| 5+ | 31.29 EUR |
| 10+ | 30.14 EUR |
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Technische Details SN99CU07AG03-1.1.3/0.5MM 250G CYNEL
Category: Solder wires - lead free, Description: Tin; lead free; Sn99Ag0,3Cu0,7; 500um; 250g; reel; 216÷227°C; 3%, Kind of flux: halide-free; No Clean; ROM0; rosin, Appearance: soldering wire, Kind of package: reel, Melting point: 216...227°C, Alloy composition: Sn99Ag0,3Cu0,7, Flux content: 3%, Density: 7.44g/cm3, Flux name: SW32, Kind of solder: lead free, Flux residues: non-corrosive; transparent; yes, Binder weight: 0.25kg, Diameter: 0.5mm, Conform to the norm: EN ISO 9453; PN EN 29454 1.1.3, Version: for soft soldering, Type of solder: tin.