SN99CU07AG03-1.1.3/1.0MM 500G CYNEL
Hersteller: CYNEL
Category: Solder wires - lead free
Description: Tin; lead free; Sn99Cu0,7Ag0,3; 1mm; 500g; reel; 216÷227°C; 3%
Type of solder: tin
Kind of solder: lead free
Appearance: soldering wire
Alloy composition: Sn99Cu0,7Ag0,3
Diameter: 1mm
Binder weight: 0.5kg
Kind of package: reel
Melting point: 216...227°C
Kind of flux: halide-free; No Clean; ROM0; rosin
Version: for soft soldering
Flux content: 3%
Flux name: SW32
Flux residues: non-corrosive; transparent; yes
Density: 7.44g/cm3
Conform to the norm: EN ISO 9453; PN EN 29454 1.1.3
| Anzahl | Privatkunde |
|---|---|
| 1+ | 93.39 EUR |
| 5+ | 90.44 EUR |
| 10+ | 82.23 EUR |
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Technische Details SN99CU07AG03-1.1.3/1.0MM 500G CYNEL
Category: Solder wires - lead free, Description: Tin; lead free; Sn99Cu0,7Ag0,3; 1mm; 500g; reel; 216÷227°C; 3%, Type of solder: tin, Kind of solder: lead free, Appearance: soldering wire, Alloy composition: Sn99Cu0,7Ag0,3, Diameter: 1mm, Binder weight: 0.5kg, Kind of package: reel, Melting point: 216...227°C, Kind of flux: halide-free; No Clean; ROM0; rosin, Version: for soft soldering, Flux content: 3%, Flux name: SW32, Flux residues: non-corrosive; transparent; yes, Density: 7.44g/cm3, Conform to the norm: EN ISO 9453; PN EN 29454 1.1.3.