SP900S-0.009-00-114 Bergquist Company
Hersteller: Bergquist Company
Thermal Interface Products SIL PAD, Low-Pressure, 0.009" Thickness, 21.01x24mm, TSP1600S/900S, IDH 2191266
| Anzahl | Preis |
|---|---|
| 4+ | 0.88 EUR |
| 10+ | 0.78 EUR |
| 25+ | 0.74 EUR |
| 50+ | 0.72 EUR |
| 100+ | 0.69 EUR |
| 250+ | 0.65 EUR |
| 500+ | 0.63 EUR |
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Technische Details SP900S-0.009-00-114 Bergquist Company
Description: THERM PAD 24MMX21.01MM PINK, Packaging: Bulk, Color: Pink, Material: Silicone Rubber, Shape: Rectangular, Thickness: 0.0090" (0.229mm), Type: Pad, Sheet, Thermal Resistivity: 0.61°C/W, Usage: TO-218, TO-220, TO-247, Outline: 24.00mm x 21.01mm, Thermal Conductivity: 1.6W/m-K, Backing, Carrier: Fiberglass, Part Status: Active.
Weitere Produktangebote SP900S-0.009-00-114 nach Preis ab 0.63 EUR bis 0.92 EUR
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SP900S-0.009-00-114 | Hersteller : Bergquist |
Description: THERM PAD 24MMX21.01MM PINK Packaging: Bulk Color: Pink Material: Silicone Rubber Shape: Rectangular Thickness: 0.0090" (0.229mm) Type: Pad, Sheet Thermal Resistivity: 0.61°C/W Usage: TO-218, TO-220, TO-247 Outline: 24.00mm x 21.01mm Thermal Conductivity: 1.6W/m-K Backing, Carrier: Fiberglass Part Status: Active |
auf Bestellung 2219 Stücke: Lieferzeit 10-14 Tag (e) |
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