SP900S-0.009-00-25 Bergquist Company
Hersteller: Bergquist Company
Thermal Interface Products SIL PAD, Low-Pressure, 0.009" Thickness, 25.4x6.6mm, TSP1600S/900S, IDH 2214788
| Anzahl | Preis |
|---|---|
| 2+ | 1.54 EUR |
| 10+ | 1.37 EUR |
| 25+ | 1.34 EUR |
| 50+ | 1.3 EUR |
| 100+ | 1.23 EUR |
| 250+ | 1.16 EUR |
| 500+ | 1.12 EUR |
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Technische Details SP900S-0.009-00-25 Bergquist Company
Description: THERM PAD 25.4MMX6.6MM PINK, Packaging: Bulk, Color: Pink, Material: Silicone Rubber, Shape: Round, Thickness: 0.0090" (0.229mm), Type: Pad, Sheet, Thermal Resistivity: 0.61°C/W, Usage: DO-5, Outline: 25.40mm x 6.60mm, Thermal Conductivity: 1.6W/m-K, Backing, Carrier: Fiberglass.
Weitere Produktangebote SP900S-0.009-00-25
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
|---|---|---|---|---|---|
 |
SP900S-0.009-00-25 | Bergquist |
Description: THERM PAD 25.4MMX6.6MM PINK Packaging: Bulk Color: Pink Material: Silicone Rubber Shape: Round Thickness: 0.0090" (0.229mm) Type: Pad, Sheet Thermal Resistivity: 0.61°C/W Usage: DO-5 Outline: 25.40mm x 6.60mm Thermal Conductivity: 1.6W/m-K Backing, Carrier: Fiberglass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| SP900S-0.009-00-25 |
|
Hersteller: Bergquist
Description: THERM PAD 25.4MMX6.6MM PINK
Packaging: Bulk
Color: Pink
Material: Silicone Rubber
Shape: Round
Thickness: 0.0090" (0.229mm)
Type: Pad, Sheet
Thermal Resistivity: 0.61°C/W
Usage: DO-5
Outline: 25.40mm x 6.60mm
Thermal Conductivity: 1.6W/m-K
Backing, Carrier: Fiberglass
Description: THERM PAD 25.4MMX6.6MM PINK
Packaging: Bulk
Color: Pink
Material: Silicone Rubber
Shape: Round
Thickness: 0.0090" (0.229mm)
Type: Pad, Sheet
Thermal Resistivity: 0.61°C/W
Usage: DO-5
Outline: 25.40mm x 6.60mm
Thermal Conductivity: 1.6W/m-K
Backing, Carrier: Fiberglass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH