SPC5516EAMMG66 NXP USA Inc.
Hersteller: NXP USA Inc.Description: IC MCU 32BIT 1MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 144
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Produktrezensionen
Produktbewertung abgeben
Technische Details SPC5516EAMMG66 NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 208MAPBGA, Packaging: Tray, Package / Case: 208-BGA, Mounting Type: Surface Mount, Speed: 66MHz, Program Memory Size: 1MB (1M x 8), RAM Size: 64K x 8, Operating Temperature: -40°C ~ 125°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, Core Processor: e200z0, e200z1, Data Converters: A/D 40x12b, Core Size: 32-Bit Dual-Core, Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V, Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI, Peripherals: DMA, POR, PWM, WDT, Supplier Device Package: 208-BGA (17x17), Number of I/O: 144, DigiKey Programmable: Not Verified.