ST33KTPM2IWLBZA9 STMicroelectronics

Description: OEM TPM CHIP_AU_DM, Packaging: Bulk, Package / Case: 24-XFBGA, WLCSP, Mounting Type: Surface Mount, Interface: I2C, SPI, Operating Temperature: -40°C ~ 105°C (TA), Voltage - Supply: 1.8V, 3.3V, Controller Series: ST33K, Applications: Trusted Platform Module (TPM), Core Processor: ARM® SecurCore® SC300, Supplier Device Package: 24-WLCSP (1.81x2.59), Number of I/O: 7.