TDA4VM88TGBALFRQ1 Texas Instruments
Hersteller: Texas Instruments
Microprocessors - MPU Automotive system-on-a-chip for L2, L3 and near-field analytic systems using deep learning 827-FCBGA -40 to 125
| Anzahl | Preis |
|---|---|
| 1+ | 190.91 EUR |
| 10+ | 181.88 EUR |
| 25+ | 178.01 EUR |
| 50+ | 177.65 EUR |
| 100+ | 176.07 EUR |
| 250+ | 166.41 EUR |
| 500+ | 166.09 EUR |
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Technische Details TDA4VM88TGBALFRQ1 Texas Instruments
Description: NEXT GENERATION SOC FAMILY FOR L, Packaging: Tape & Reel (TR), Package / Case: 827-BFBGA, FCBGA, Speed: 2GHz, 1GHz, 1.35GHz, 1GHz, RAM Size: 1.5MB, Operating Temperature: -40°C ~ 125°C (TJ), Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x, Connectivity: MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB, Peripherals: DMA, PWM, WDT, Supplier Device Package: 827-FCBGA (24x24), Architecture: DSP, MCU, MPU, Grade: Automotive, Part Status: Active, Qualification: AEC-Q100.
Weitere Produktangebote TDA4VM88TGBALFRQ1 nach Preis ab 196.03 EUR bis 241.98 EUR
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TDA4VM88TGBALFRQ1 | Texas Instruments |
Description: NEXT GENERATION SOC FAMILY FOR L Packaging: Cut Tape (CT) Package / Case: 827-BFBGA, FCBGA Speed: 2GHz, 1GHz, 1.35GHz, 1GHz RAM Size: 1.5MB Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x Connectivity: MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB Peripherals: DMA, PWM, WDT Supplier Device Package: 827-FCBGA (24x24) Architecture: DSP, MCU, MPU Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 212 Stücke: Lieferzeit 10-14 Tag (e) |
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| TDA4VM88TGBALFRQ1 |
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Hersteller: Texas Instruments
Description: NEXT GENERATION SOC FAMILY FOR L
Packaging: Cut Tape (CT)
Package / Case: 827-BFBGA, FCBGA
Speed: 2GHz, 1GHz, 1.35GHz, 1GHz
RAM Size: 1.5MB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
Connectivity: MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 827-FCBGA (24x24)
Architecture: DSP, MCU, MPU
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: NEXT GENERATION SOC FAMILY FOR L
Packaging: Cut Tape (CT)
Package / Case: 827-BFBGA, FCBGA
Speed: 2GHz, 1GHz, 1.35GHz, 1GHz
RAM Size: 1.5MB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
Connectivity: MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 827-FCBGA (24x24)
Architecture: DSP, MCU, MPU
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 212 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 241.98 EUR |
| 10+ | 205.21 EUR |
| 25+ | 196.03 EUR |