Technische Details TE0720-03-61Q33MA Trenz Electronic
Description: IC SOC MODULE XILINX ZYNQ, Packaging: Bulk, Connector Type: Samtec LSHM, Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm), RAM Size: 1GB, Operating Temperature: -40°C ~ 85°C, Module/Board Type: MCU, FPGA, Core Processor: ARM Cortex-A9, Co-Processor: Zynq-7000 (Z-7020), Flash Size: 8GB, Part Status: Discontinued at Digi-Key.
Weitere Produktangebote TE0720-03-61Q33MA
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TE0720-03-61Q33MA | Hersteller : Trenz Electronic GmbH |
 Description: IC SOC MODULE XILINX ZYNQPackaging: Bulk Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 1GB Operating Temperature: -40°C ~ 85°C Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Flash Size: 8GB Part Status: Discontinued at Digi-Key |
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