TE0729-02-62I65FM Trenz Electronic GmbH
Hersteller: Trenz Electronic GmbH
Description: IC SOC MODULE ZYNQ
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 512MB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Flash Size: 32MB
Part Status: Discontinued at Digi-Key
Description: IC SOC MODULE ZYNQ
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 512MB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Flash Size: 32MB
Part Status: Discontinued at Digi-Key
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Technische Details TE0729-02-62I65FM Trenz Electronic GmbH
Description: IC SOC MODULE ZYNQ, Packaging: Bulk, Connector Type: B2B, Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm), RAM Size: 512MB, Operating Temperature: -40°C ~ 85°C, Module/Board Type: MCU, FPGA, Core Processor: ARM Cortex-A9, Co-Processor: Zynq-7000 (Z-7020), Flash Size: 32MB, Part Status: Discontinued at Digi-Key.