TE0782-02-A2I33MA Trenz Electronic
Hersteller: Trenz Electronic
System-On-Modules - SOM High-Performance FPGA-Module with AMD Zynq 7100-2I, 1 GByte DDR3L, 8,5 x 8,5 cm
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Technische Details TE0782-02-A2I33MA Trenz Electronic
Description: IC MODULE CORTEX, Packaging: Bulk, Connector Type: Board-to-Board (BTB) Socket, Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm), RAM Size: 1GB, Operating Temperature: -40°C ~ 85°C, Module/Board Type: MCU, FPGA, Core Processor: ARM Cortex-A9, Co-Processor: Zynq-7000 (Z-7100), Flash Size: 32MB.
Weitere Produktangebote TE0782-02-A2I33MA nach Preis ab 6133.2 EUR bis 6133.2 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
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TE0782-02-A2I33MA | Trenz Electronic GmbH |
Description: IC MODULE CORTEX Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm) RAM Size: 1GB Operating Temperature: -40°C ~ 85°C Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7100) Flash Size: 32MB |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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| TE0782-02-A2I33MA |
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Hersteller: Trenz Electronic GmbH
Description: IC MODULE CORTEX
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7100)
Flash Size: 32MB
Description: IC MODULE CORTEX
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7100)
Flash Size: 32MB
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 6133.2 EUR |