TE0808-05-9BE21-LZ Trenz Electronic GmbH
Hersteller: Trenz Electronic GmbH
Description: ULTRASOM+ MPSOC MODULE WITH AMD
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 4 x 160
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E
Flash Size: 128MB
Description: ULTRASOM+ MPSOC MODULE WITH AMD
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 4 x 160
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E
Flash Size: 128MB
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Technische Details TE0808-05-9BE21-LZ Trenz Electronic GmbH
Description: ULTRASOM+ MPSOC MODULE WITH AMD, Packaging: Bulk, Connector Type: Board-to-Board (BTB) Socket - 4 x 160, Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm), RAM Size: 4GB, Operating Temperature: 0°C ~ 85°C, Module/Board Type: MPU Core, Core Processor: Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E, Flash Size: 128MB.