TE0808-05-BBE21-AZ Trenz Electronic GmbH
Hersteller: Trenz Electronic GmbHDescription: MODULE MPSOC 2GB DDR4
Packaging: Box
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: FPGA Core
Core Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E
Flash Size: 128MB
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 3492.51 EUR |
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Technische Details TE0808-05-BBE21-AZ Trenz Electronic GmbH
Description: MODULE MPSOC 2GB DDR4, Packaging: Box, Connector Type: Board-to-Board (BTB) Socket, Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm), RAM Size: 2GB, Operating Temperature: 0°C ~ 85°C, Module/Board Type: FPGA Core, Core Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E, Flash Size: 128MB, Part Status: Active.