Technische Details TE0818-01-6BE21-A Trenz Electronic
Description: ULTRASOM+ MPSOC MODULE WITH ZYNQ, Packaging: Bulk, Connector Type: Board-to-Board (BTB) Socket - 240, Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm), RAM Size: 4GB, Operating Temperature: 0°C ~ 85°C, Module/Board Type: MPU Core, Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E, Flash Size: 128MB.
Weitere Produktangebote TE0818-01-6BE21-A
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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|---|---|---|---|---|---|
| TE0818-01-6BE21-A | Hersteller : Trenz Electronic GmbH |
Description: ULTRASOM+ MPSOC MODULE WITH ZYNQ Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) RAM Size: 4GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E Flash Size: 128MB |
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