TE0841-02-040-1I Trenz Electronic GmbH
Hersteller: Trenz Electronic GmbHDescription: IC MODULE USCALE 512MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 512MB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: FPGA Core
Core Processor: Kintex UltraScale KU40
Flash Size: 32MB
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Technische Details TE0841-02-040-1I Trenz Electronic GmbH
Description: IC MODULE USCALE 512MB, Packaging: Bulk, Connector Type: B2B, Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm), RAM Size: 512MB, Operating Temperature: -40°C ~ 85°C, Module/Board Type: FPGA Core, Core Processor: Kintex UltraScale KU40, Flash Size: 32MB.