Technische Details TE0865-02-ABI21MA Trenz Electronic
Description: MPSOC MODULE WITH ZYNQ ULTRASCAL, Packaging: Bulk, Connector Type: Board-to-Board (BTB) Socket, Size / Dimension: 3.937" L x 2.953" W (100.00mm x 75.00mm), RAM Size: 4GB, Operating Temperature: 0°C ~ 85°C, Module/Board Type: MPU Core, Core Processor: Zynq™ UltraScale+™ XCZU11EG-1FFVC1760I, Flash Size: 256MB.
Weitere Produktangebote TE0865-02-ABI21MA
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
| TE0865-02-ABI21MA | Hersteller : Trenz Electronic GmbH |
Description: MPSOC MODULE WITH ZYNQ ULTRASCAL Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 3.937" L x 2.953" W (100.00mm x 75.00mm) RAM Size: 4GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ XCZU11EG-1FFVC1760I Flash Size: 256MB |
Produkt ist nicht verfügbar |