TFM-110-02-S-D-WT-TR Samtec
auf Bestellung 324 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 6.60 EUR |
| 25+ | 6.05 EUR |
| 50+ | 5.53 EUR |
| 100+ | 5.12 EUR |
| 975+ | 4.73 EUR |
| 2275+ | 4.72 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details TFM-110-02-S-D-WT-TR Samtec
Description: CONN HEADER SMD 20POS 1.27MM, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Voltage Rating: 275VAC, Current Rating (Amps): 2.9A per Contact, Mounting Type: Surface Mount, Number of Positions: 20, Number of Rows: 2, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.220" (5.60mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.050" (1.27mm), Contact Length - Mating: 0.131" (3.33mm).
Weitere Produktangebote TFM-110-02-S-D-WT-TR nach Preis ab 12.07 EUR bis 15.01 EUR
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TFM-110-02-S-D-WT-TR | Hersteller : Samtec Inc. |
Description: CONN HEADER SMD 20POS 1.27MM Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Header Voltage Rating: 275VAC Current Rating (Amps): 2.9A per Contact Mounting Type: Surface Mount Number of Positions: 20 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.220" (5.60mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.050" (1.27mm) Contact Length - Mating: 0.131" (3.33mm) |
auf Bestellung 194 Stücke: Lieferzeit 10-14 Tag (e) |
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TFM-110-02-S-D-WT-TR | Hersteller : Samtec Inc. |
Description: CONN HEADER SMD 20POS 1.27MM Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header Voltage Rating: 275VAC Current Rating (Amps): 2.9A per Contact Mounting Type: Surface Mount Number of Positions: 20 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.220" (5.60mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.050" (1.27mm) Contact Length - Mating: 0.131" (3.33mm) |
Produkt ist nicht verfügbar |