Produkte > T-GLOBAL TECHNOLOGY > TI900-144.4-38-0.12-0
TI900-144.4-38-0.12-0

TI900-144.4-38-0.12-0 t-Global Technology

Ti900_UK.pdf
Hersteller: t-Global Technology
Description: THERM PAD 144.4MMX38MM WHT
Backing, Carrier: Viscose
Thermal Conductivity: 1.8W/m-K
Outline: 144.40mm x 38.00mm
Type: Conductive Insulator Pad
Thickness: 0.0050" (0.127mm)
Shape: Rectangular
Material: Silicone
Color: White
Packaging: Box
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Technische Details TI900-144.4-38-0.12-0 t-Global Technology

Description: THERM PAD 144.4MMX38MM WHT, Backing, Carrier: Viscose, Thermal Conductivity: 1.8W/m-K, Outline: 144.40mm x 38.00mm, Type: Conductive Insulator Pad, Thickness: 0.0050" (0.127mm), Shape: Rectangular, Material: Silicone, Color: White, Packaging: Box.