TI900-24-21.01-0.12-0 t-Global Technology
Hersteller: t-Global Technology
Description: THERM PAD 24MMX21.01MM WHT
Backing, Carrier: Viscose
Thermal Conductivity: 1.8W/m-K
Outline: 24.00mm x 21.01mm
Type: Conductive Insulator Pad
Thickness: 0.0050" (0.127mm)
Shape: Rectangular
Material: Silicone
Color: White
Packaging: Box
| Anzahl | Preis |
|---|---|
| 20+ | 0.9 EUR |
| 22+ | 0.8 EUR |
| 25+ | 0.76 EUR |
| 50+ | 0.73 EUR |
| 100+ | 0.71 EUR |
| 250+ | 0.67 EUR |
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Technische Details TI900-24-21.01-0.12-0 t-Global Technology
Description: THERM PAD 24MMX21.01MM WHT, Backing, Carrier: Viscose, Thermal Conductivity: 1.8W/m-K, Outline: 24.00mm x 21.01mm, Type: Conductive Insulator Pad, Thickness: 0.0050" (0.127mm), Shape: Rectangular, Material: Silicone, Color: White, Packaging: Box.

