TI900-24-21.01-0.12-0 t-Global Technology
Hersteller: t-Global Technology
Description: THERM PAD 24MMX21.01MM WHT
Packaging: Box
Color: White
Material: Silicone
Shape: Rectangular
Thickness: 0.0050" (0.127mm)
Type: Conductive Insulator Pad
Outline: 24.00mm x 21.01mm
Thermal Conductivity: 1.8W/m-K
Backing, Carrier: Viscose
Description: THERM PAD 24MMX21.01MM WHT
Packaging: Box
Color: White
Material: Silicone
Shape: Rectangular
Thickness: 0.0050" (0.127mm)
Type: Conductive Insulator Pad
Outline: 24.00mm x 21.01mm
Thermal Conductivity: 1.8W/m-K
Backing, Carrier: Viscose
auf Bestellung 517 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
19+ | 0.93 EUR |
20+ | 0.88 EUR |
25+ | 0.84 EUR |
50+ | 0.81 EUR |
100+ | 0.8 EUR |
250+ | 0.75 EUR |
500+ | 0.7 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details TI900-24-21.01-0.12-0 t-Global Technology
Description: THERM PAD 24MMX21.01MM WHT, Packaging: Box, Color: White, Material: Silicone, Shape: Rectangular, Thickness: 0.0050" (0.127mm), Type: Conductive Insulator Pad, Outline: 24.00mm x 21.01mm, Thermal Conductivity: 1.8W/m-K, Backing, Carrier: Viscose.