TI900-30-30-0.12-0 t-Global Technology
Hersteller: t-Global Technology
Description: THERM PAD 30MMX30MM WHT
Backing, Carrier: Viscose
Thermal Conductivity: 1.8W/m-K
Outline: 30.00mm x 30.00mm
Type: Conductive Insulator Pad
Thickness: 0.0050" (0.127mm)
Shape: Square
Material: Silicone
Color: White
Packaging: Box
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Technische Details TI900-30-30-0.12-0 t-Global Technology
Description: THERM PAD 30MMX30MM WHT, Backing, Carrier: Viscose, Thermal Conductivity: 1.8W/m-K, Outline: 30.00mm x 30.00mm, Type: Conductive Insulator Pad, Thickness: 0.0050" (0.127mm), Shape: Square, Material: Silicone, Color: White, Packaging: Box.

