TLA-3T112LF TDK Corporation
Hersteller: TDK CorporationDescription: XFRMR FOR CS8900A CHIP SET 16SOP
Packaging: Tray
Inductance: 130µH
Size / Dimension: 0.457" L x 0.268" W (11.60mm x 6.80mm)
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C
Transformer Type: LAN
Turns Ratio - Primary:Secondary: 1CT:1CT, 1CT:2.5CT
Height - Seated (Max): 0.232" (5.90mm)
Part Status: Obsolete
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Technische Details TLA-3T112LF TDK Corporation
Description: XFRMR FOR CS8900A CHIP SET 16SOP, Packaging: Tray, Inductance: 130µH, Size / Dimension: 0.457" L x 0.268" W (11.60mm x 6.80mm), Mounting Type: Surface Mount, Operating Temperature: 0°C ~ 70°C, Transformer Type: LAN, Turns Ratio - Primary:Secondary: 1CT:1CT, 1CT:2.5CT, Height - Seated (Max): 0.232" (5.90mm), Part Status: Obsolete.
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